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Silicon wafer thinning grinding wheel
Silicon wafer thinning grinding wheel
Application:  
Applied to sapphire substrate extension, sic substrate extension, zirconium oxide ceramics, etc
Workware materials: 
Artificial sapphire, sic, monocrystalline silicon, etc
Specification:
1.Bond:Ceramic bond,resin bond,metal bond
2.Diameter:φ175、φ195、φ209、φ255、φ305、φ355
3.Grit size:200#、400#、800#、1200# 、1500# 、3000#、6000#、8000#、15000#、30000#
4.Suitable machine:DISCO,OKAMOTO,TSK,STRABAUGH,etc.

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